PACK EXPO Links Packaging, Printing & Converting

There is a tremendous amount of opportunity for the package printing industry. From incredible growth in the digital sector to smart labels to photo-like quality graphics, brand owners are seeking to connect with printers, printing equipment suppliers, and converters to stay ahead of the curve.

PACK EXPO International 2012 (October 28-31; McCormick Place, Chicago) provides the perfect bridge between these audiences. The show will feature innovations from all aspects of the industry, including digital, flexographic, and other technologies, labeling, coding and marking equipment, as well as inks and advances in substrates like paperboard, rigid plastic, and flexible packaging.

In addition, The Brand Zone will showcase a wide range of advances in materials and containers as well as new features from Mintel, Material ConneXion, and Clemson University that demonstrate the power of packaging that engages consumers’ senses of sight and touch. The Conference at PACK EXPO will offer even more value to attendees, with educational programming provided by leading industry associations, such as Institute of Packaging Professionals (IoPP) and The Packaging Assn. (PAC) to cover a wide range of topics impacting today’s packaging industry.


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