Connect with the Asian Flexible Packaging Market

Published: June 07, 2006, By pffc-online.com

PRESS RELEASE

SHANGHAI, CHINA—TAPPI and Reed Huayin Exhibitions announce the first AsiaPLACE Symposium, to be held October 24-25, 2006, in Shanghai, China. It will provide TAPPI members an introduction to the flexible packaging industry in China, which is growing more than 9% annually. The symposium is designed to attract professionals from the Asian flexible packaging industry and will provide new technologies and techniques within converting operations, as well as practical tips for troubleshooting related to resins, film extrusion, and extrusion coating.

AsiaPLACE occurs just prior to Sino-Flexpack 2006 and all sessions will be conducted in Mandarin. For more information, visit tappi.org/06ASIAPLC.