- March 31, 2004, David J. Bentley, Jr., Editor
Providing practical information to the converting & packaging industries.
Conference Features Tutorial
In response to feedback from previous attendees, the 2004 PLACE Conference in Indianapolis, Indiana, on August 30 to September 2 will feature a session called “Flexible Film Web Handling and Winding Tutorial.” According to Beth Wells of Black Clawson Converting Machinery, Inc., who is the technical program chairperson for the meeting, “We have learned that registrants at PLACE Conferences always want practical information that they can use immediately upon their return to work. Providing tutorials that focus on a specific area are an excellent way for our conference to meet this need. Since the basic premise of all converting and packaging involves the handling of webs, we are offering a tutorial this year on this subject to provide tools that attendees can use to solve or prevent web handling problems at their companies.”
The session chairperson for the “Flexible Film Web Handling and Winding Tutorial” is R. Duane Smith of Black Clawson Converting Machinery, Inc. He is product manager—winders for the company and is a widely recognized expert in the field of winding. He has assembled a distinguished panel for the session consisting of the following people who will address the indicated topics in 30-minute presentations:
- “Importance of Web Handling in Avoiding Film Wrinkles” by David Roissum of Finishing Technologies
- “Film Web Tensions and Tension Control Systems and Applications” by John Campbell of Nexen Group”
- “Film Slitting Systems and Applications” by David Rumson of Dienes Corporation
- “Film Spreading and Edge-Guiding Systems and Applications” by Jeff Damour of Converter Accessory Corp. and Ron Schmidt of Maxcess International
- “Film Winding Systems and Applications” by Tim Walker of TJ Walker and Associates.
Following the formal presentations, all the speakers will form a “Flexible Film Web Handling and Winding ‘Ask The Experts Panel.’” This 60-minute portion of the session will provide an excellent opportunity for attendees to discuss their specific questions and problems in the real world. “The panelists bring a total of 169 years of experience in web handling and winding. No where on this earth will the attendees be able to pick the brains of such a knowledgeable group of web handling experts all gathered in one place” according to Smith. “Everyone should take advantage of this opportunity and bring to this session their web handling questions that need solutions.” Each member of the audience will receive a preprinted copy of the PowerPoint presentations made by each speaker in the tutorial on which they can make their notes for future reference. “Reprints of the slides are much easier to follow and save as a reference especially when they contain the many rules of thumb that these talented and knowledgeable instructors will be presenting,” said Smith.
The Westin Indianapolis Hotel in Indianapolis, Indiana, will be the location for the 2004 PLACE Conference. Besides this tutorial session on web handling, the meeting will feature more than 20 sessions featuring subjects of prime interest to people involved in polymers, laminations, adhesives, coatings, and extrusions. For registration information or an up-to-date program as it develops, see tappi.org. Follow the links marked Conferences & Symposia and select 2004 PLACE Conference. Information is available by telephone at 1-800-332-8686 (US), 1-800-446-9431 (Canada), or +1-770-446-1400 (Other).
New Scholarship Chairperson
John Ozcomert has accepted the role of Scholarship Chairperson for the PLACE Division of TAPPI. “After spending many years doing fundamental research in academia, I can definitely relate to students wishing to apply educational lessons to the practical needs of industry. I applaud the PLACE Division of TAPPI for its support of such efforts. I will try to ensure that news of our scholarship reaches strong candidates that can benefit from such assistance.”
After earning Masters and Ph.D. degrees in physical chemistry, Ozcomert spent several years as a research scientist. He entered the packaging industry in 1995 as an analytical chemist for what was then DRG Medical Packaging. After moving into product development and several technical management roles, he now heads product development and technical services for the Americas operations of Amcor Flexibles Healthcare. “I have found my science background to be very helpful in my role with Amcor and definitely credit my schooling with giving me an appreciation of a systematic approach to problem solving.”
Ozcomert's activities in the PLACE Division of TAPPI include serving on the Flexible Packaging Committee and chairing a session at the 2004 PLACE Conference. He is also a member of ASTM, IOPP, and the Sterile Packaging Manufacturers Council (SPMC) of the Flexible Packaging Association. “My experience has shown that the PLACE Division of TAPPI is an excellent source of contacts and information that I can use directly in the challenges facing my business. The PLACE Division is an excellent forum for networking that college and university students do not use sufficiently. If these students can only attend one industry event this year, I strongly recommend that they come to the 2004 PLACE Conference.”
Ozcomert has extended the deadline for submission of applications for the $1000 Ralph A. Klucken Scholarship Award. Contact him by email at email@example.com for complete information.
For information about the PLACE Division of TAPPI, access the TAPPI web page at TAPPI.org. To obtain the complete papers whose expanded summaries appear in PFFC's "the PLACE" section, go to the TAPPI web site at TAPPI.org. Then click on “the PLACE” in the section designated Journals.
Telephone inquiries are welcome at the TAPPI Service Line by calling 1-800-332-8686 in the United States, 1-800-446-9431 in Canada, or +1-770-446-1400 in other countries. Send FAX to 1-770-446-6947. Address mail to TAPPI, Box 105113, Atlanta, GA, 30348-5113. Contact “the PLACE” editor by email at firstname.lastname@example.org.