PACK EXPO Connects with Printers at

CHICAGO, IL | The printing industry is rapidly changing. As printers, printing equipment suppliers, and converters look to provide brand managers with the latest technologies and best quality graphics for their packaging, they need a way to connect with them.

So it brings us great pleasure to announce that PACK EXPO International 2012 (October 28-31; McCormick Place, Chicago) will sponsor PFFC’s ‘Printing’ category. As North America’s largest resource for packaging innovation, PACK EXPO is a perfect fit to bridge this sector to PFFC’s printing and converting audience. The show will feature innovations from all aspects of the industry, including digital, flexographic and other technologies, labeling, coding and marking equipment, as well as inks and advances in substrates like paperboard, rigid plastic, and flexible packaging.

Visit to see it for yourself and link over to to discover the latest information about the show and to register.

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