TAPPI's PLACE Conference Coming in September

PRESS RELEASE

The TAPPI PLACE conference will take place September 17-21, 2006, at the Hyatt Regency in Cincinnati, OH. It will showcase innovations in materials, equipment, and processes in the flexible packaging and converting industry. Attendees will learn about:

  • New developments in flexible packaging, barrier films, sealant films, adhesives, coatings, additives, and resins.
  • Latest developments in polymer extrusion, adhesive laminating, and coating equipment design.
  • Cost-reduction opportunities and equipment advances.
  • How advances in packaging technology have been applied in manufacturing process improvement.
The TAPPI PLACE Conference also will include a tabletop trade fair, a new technology showcase, R&D pilot plant tour, networking events, and a pre-conference RFID smart packaging workshop. It is said to be ideal for everyone in the flexible packaging and converting industry supply chain.

Visit tappiplace.org for more information.



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