TAPPI's PLACE Conference Coming in September


The TAPPI PLACE conference will take place September 17-21, 2006, at the Hyatt Regency in Cincinnati, OH. It will showcase innovations in materials, equipment, and processes in the flexible packaging and converting industry. Attendees will learn about:

  • New developments in flexible packaging, barrier films, sealant films, adhesives, coatings, additives, and resins.
  • Latest developments in polymer extrusion, adhesive laminating, and coating equipment design.
  • Cost-reduction opportunities and equipment advances.
  • How advances in packaging technology have been applied in manufacturing process improvement.
The TAPPI PLACE Conference also will include a tabletop trade fair, a new technology showcase, R&D pilot plant tour, networking events, and a pre-conference RFID smart packaging workshop. It is said to be ideal for everyone in the flexible packaging and converting industry supply chain.

Visit tappiplace.org for more information.

Subscribe to PFFC's EClips Newsletter