Bobst Gears Up for IADD FSEA Odyssey
- Published: April 29, 2007, By pffc-online.com
PRESS RELEASE
ROSELAND, NJ—Bobst Group North America will exhibit the latest in diecutting, foil stamping, and folding/gluing technologies at the IADD FSEA Odyssey in Milwaukee, WI. During the May 2-4, 2007, event, Bobst will exhibit the SPanthera 106-LER diecutter, SP 102-BMA Foilmaster, and the Mistral 110 A-2 folder/gluer.
Bobst representatives and equipment also will participate in the training sessions held throughout the three-day event, including:
- "Designing for Folding and Gluing Success," in which Bobst Group North America, PCR technical service manager Yvan Magni will discuss how to improve folder/gluer productivity by starting upstream.
- Efficient Setup on Multi-Up Foil Stamping Jobs," which will feature the Bobst SP 102-BMA Foilstamper.
- "Blanking, Nicking, and Rubbering," featureing the Bobst SPanthera 106-LER diecutter.
