Rohm and Haas to Intro Total Packaging Solutions at Pack Expo

PHILADELPHIA, PA, USA—Rohm and Haas Company reports its participation in the two of the world's largest packaging expos this fall. According to the adhesive manufacturer, major product introductions under the company's "Total Packaging Solutions" are planned during Pack Expo, November 3 - 7, 2002, Chicago, IL, and at Emballage 2002, Paris, France

At Emballage, says Rohm and Haas, it will feature its new Robond L water-based adhesives; Mor-Free solventless adhesives; and Adcote solvent-based adhesives, as well as its Robond CS cold seal product offering and its new Mor-Free ELM products. "Introduction of the new Mor-Free ELM series of solventless laminating adhesives for flexible packaging applications promises extremely low monomer adhesives specially formulated to meet a wide array of food packaging needs," adds the co.

During Pack Expo, the company says it will showcase its new product offerings under the Robond L, Mor-Free, and Adcote brands. "New Robond L100/CR2 technology is being touted as a revolutionary method to achieve unparalleled performance in water-based adhesive systems," reports Rohm and Haas. "Robond L products provide dry-bond laminating adhesion through environmentally friendly, water-based chemistry. New product offerings under [our] long popular Adcote solvent-based laminating adhesive line-up will present new chemistries that provide improved versatility in performance, plus new technologies for retort applications."

Rohm and Haas will be exhibiting at stand/booth R80 in Hall 5b at Emballage 2002, and at Pack Expo, McCormick Place, Chicago, IL, USA, you'll find the company at booth E 7913. Visit Rohm and Haas at

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