New Packaging Event in India Is Reported

CHICAGO, IL | The trade fair organizers Messe Düsseldorf India and the Indian Institute of Packaging (IIP) have agreed to collaborate and starting next year, they will combine their expertise in the packaging sector and the related processing industry with a focus on the Indian market. In October 2017, a combination of the new pacprocess India trade fair and IndiaPack (an event created by IIP) is planned in New Delhi. pacprocess India is a further development of International PackTech India, previously organized with the involvement of Messe Düsseldorf until 2016.

In the future, Messe Düsseldorf and its Indian subsidiary will be responsible for the strategy, conceptual planning, and implementation of the trade fairs as well as for the national and international marketing. The events form part of the interpack alliance, consisting of the international events of Messe Düsseldorf in the packaging and processing segment. The trade fairs will be complemented by the International Summit for Packaging Industry (ISPI) organized by IIP.

Starting in 2017, the trade fairs will be held annually, alternating between different cities. After New Delhi in 2017 and Mumbai in 2018, the venue will be Bangalore in 2019. In 2018, drink technology India, organized by Messe München (Munich), will be held concurrently at the Bombay Convention & Exhibition Centre.

“The Indian Institute of Packaging will be a strong partner for us so that we can continue to offer our customers the leading platform for this industry in India,” says Bernd Jablonowski, Global Portfolio Director Processing & Packaging at Messe Düsseldorf. “Also, for the Indian market, we are therefore consistently working on our goal of establishing interpack alliance trade fairs as number-one events in the region.”

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