- October 19, 2010
ARLINGTON, VA | With leading experts on hand to address food safety themes and specific questions, the Food Safety Summit Resource Ctr. at Pack Expo Intl. 2010, McCormick Pl., Chicago, from Oct. 31—Nov. 3, 2010, is designed to help manufacturers and processors respond to the challenges they face on the job.
The result of a partnership between PMMI, producer of the Pack Expo family of trade shows, and BNP Media, producer of the annual Food Safety Summit, the Food Safety Summit Resource Ctr., gives attendees a forum to discuss their specific food safety challenges, learn about the latest breakthroughs and gain insight into potential solutions.
“To ensure safety in this era of global supply chains and increased automation, manufacturers need stricter controls in product processing, packaging, transport and handling,” says Charles D. Yuska, president and CEO of PMMI, sponsor and producer of Pack Expo. “The Food Safety Summit Resource Center will connect Pack Expo attendees with leading experts who can help them find solutions to critical challenges.”
The experts on hand will make formal presentations on leading food safety issues, including foreign material detection, sanitation, traceability, hygiene, interventions and analytics. Confirmed presenters include AcryliCon Industrial Flooring, Afilias Discovery Services, Alchemy Systems, Applied Robotics, ConAgra Foods, DayMark Safety DNV Systems, Integrated Resources, ITW, Ingersoll-Rand, Invensys, Kestrel Management, Loma Systems, Michigan State Univ., MOCON, The National Food Lab, Northwest Analytical, Inc., PakSense, Inc., Qualtrax, Siemens Security Solutions, Specialized Technology Resources, Steritech, and TraceGains.
The Food Safety Summit Resource Ctr, will be located in Booth E-7040 in the Lakeside Ctr. in the East Building. To schedule one-to-one meetings with a food safety expert, contact Katie Johnson, BNP Media: firstname.lastname@example.org or 847/405-4053. For more information or to register for Pack Expo Intl. 2010, visit www.packexpo.com.