TAPPI Now Accepting Abstracts for the 2008 PLACE Conference


Introduce your latest innovation, development, or research to the industry during the 2008 PLACE Conference September 14-17, 2008. Sponsored by TAPPI's Polymers, Laminations, Adhesives, Coatings and Extrusions (PLACE) div., this conference will attract industry professionals from all areas of the flexible packaging and converting industries.

The 2008 program will focus on innovations in flexible consumer packaging. Key topics will include:

  • Brand owner presentations.
  • Sustainability.
  • Biodegradable packaging.
  • Nanotechnology.
  • Intelligent/smart packaging.
  • Barrier innovations.
  • Food safety.
  • Converting solutions.
  • Performance packaging.
  • Productivity enhancement.
If you are interested in presenting at the TAPPI Place Conference, submit an abstract or technical paper online no later than January 25, 2008. Opportunities are available for individual papers, panel discussions, tutorial, and workshop sessions. The peer-review of all submissions will be held in February and feedback will be provided to authors shortly thereafter. Additional information, along with submission guidelines, is available online at tappi.org.

Enercon Corona Technology

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