Issues in Barrier Packaging

PRESS RELEASE

NORCROSS, GA—TAPPI will present a symposium entitled “Innovations in Barrier Packaging” June 7–8, 2006, at the Atlanta Marriott Marquis. With PFFC as a cosponsor, the event will bring together professionals from the entire flexible packaging supply chain to network and learn about new technologies, practices, and applications.

Topics will include converting technology to enhance package performance; designed permeation including MAP and CAP; market criteria for protection, appearance, and performance; new materials including clear barriers and nanocomposites; and the latest issues and trends driving the barrier packaging market.

For more information visit tappiplace.org or call 800/332-8686.



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Enercon Corona Technology

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